ABB FS450R17KE3/AGDR-72C 450 A Sixpack IGBT Module

ABB FS450R17KE3/AGDR-72C 450 A Sixpack IGBT Module

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Cables

In contrast to conventional paste-application methods, the screen-printing procedure applies the thermal compound only to areas where it is required. For this process, a surface scan of the baseplate is used to determine the quantity of thermal compound required. Figure 1 shows the baseplate surface structure of a mounted EconoPACK™ 3 module. 

The blue or violet lines represent the metallic contact with the heat sink, and the red lines indicate areas that do not show thermal contact with the heat sink. The cavities in the baseplate have to be filled with thermal compounds. To determine the required paste, divide the surface scan into a grid. For each grid point, a sufficient amount of paste has to be determined. Figure 2 shows the screen-printing template of an EconoPACK™ 3 with three DCBs from this procedure.

ABB FS450R17KE3/AGDR-72C Technical drawing:

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