ABB IMMFP12 Multi-Function Processor Module

ABB IMMFP12 Multi-Function Processor Module

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Cables 

Thermal cycling raises and lowers the case temperature at relatively long intervals in a time frame of minutes. It mainly puts stress on the soldered joints between DCB substrate and module baseplate. Figure 7 shows examples of thermal-cycling diagrams, which provide information on achievable stress (= number of temperature cycles) vs. temperature swing during the lifetime of the solder joint described above. 

The case temperature of the presumably hottest chip position, which can be either measured in the base plate under lab conditions or simulated under application conditions, is used as a measure. 

ABB IMMFP12 Technical drawing:

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