ABB NTMP01 Multi-Function Processor TU

ABB NTMP01 Multi-Function Processor TU

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Cables

The use of copper as base plate material is common for its well-known advantages with regard to easy mechanical handling and high thermal conductivity. A disadvantage is the mismatch of the coefficient of thermal expansion (CTE) to the ceramic substrates. Different CTEs of the materials, together with thermal stress, generate mechanical strain on the solder. Repetitive, heavy load cycles will create solder cracks, and therefore an increase of the thermal impedance between chip and base plate. 

A relatively stiff material such as AlSiC, with its low deviation of the CTE to the substrate ceramic, solve the described problem. Furthermore, the diminished bimetallic effect results in a well-balanced contact surface to the heat sink. The most outstanding advantage can be seen in the gain of reliability. At highly accelerated cycling tests at Tc = 80 K, the solder layer between the copper base plate and ceramic shows severe delamination at the edges of the substrate after some few thousand cycles, while modules with AlSiC base plates exceed this value by far. 

ABB NTMP01 Technical drawing:

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