ABB 1SDA038343R1 Description Circuit Breaker Accessories

ABB 1SDA038343R1 Description Circuit Breaker Accessories

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Power cycling raises and lowers the chip-junction temperature at relatively short intervals in a timeframe of seconds. It mainly puts stress on the bond wires on the silicon chips, and the soldered joints below the silicon chips. The power-cycling capability of power semiconductor devices is dependent on the absolute junction temperature Tvj, the temperature swing ∆Tvj, the duration tcyc and the on-time ton of the cycle. Typically, as in this case, during the power cycling test the same conditions such as load current and Tvjmax are periodically repeated. 

In case of products not having the on-time ton PC curve like IPM, the time-dependent PC impact can be omitted for simplification. 

The junction temperature Tvj is the temperature of the semiconductor junction region. Since the junction temperature can only be determined either by indirect measurement or calculation, it is termed “virtual junction temperature.” 

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