ABB 1SDA073700R1 SACE FORMULA MCCB Molded Case Circuit Breaker

ABB 1SDA073700R1 SACE FORMULA MCCB Molded Case Circuit Breaker

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Cables 

Typically, the wire-bonding process is used for the electrical interconnections of the specific products discussed in this document, i.e. industrial power modules, IPMs, and discrete devices, as illustrated in Figure 1. For instance the IGBT power module sample shown in Figure 1 comprises approximately 450 wires together with 900 wedge bonds. For many years, the reliability of this contact technology had been a concern. 

Considerable work has been concentrated on accelerated power-cycling tests, analysis of failure mechanisms, and improvements in bonding and die attach technology. Developments in the composition of wire, the shape of bonding tools, bonding parameters, chip metallization, and the mold compound as well as the introduction of improved die attach processes, such as diffusion soldering and sintering, have led to considerable improvements in the reliability and lifetime of the power semiconductor devices. 

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